ST-127-1.0-3.0 TE Cooler Tech Data Sheet

QC vs. I Curve

TM-127-1.0-3.0M is our least powerful single-stage thermoelectric module, in the 30 x 30 mm footprint, intended for use with 12 to 15-volt DC power sources. This module is best used in applications where loads (or DT's) are not substantial. This is often an excellent choice if temperature stabilization near ambient is desired or when space for a hot-side heatsink is limited. Also available with metallized and tinned surface/s.

TM-127-1.0-3.0M may be used for cooling, heating and temperature stabilization and is employed in a wide range of applications including electro-optic/telecommunications, lab/scientific/biomedical, consumer and aerospace/military.

100% QC including thermal cycling "burn-in" available.

Maximum operating temperature +150°C
Melting point of internal solder (Pb/Sn): 183°C
Antidiffusion barriers prevent solder migration

A High Performace "HP" version of this module is available and should be selected for high temperature and/or thermal cycling applications

Option Suffix designations: Anti-corrosion Potting "P"
Epoxy edge sealing "E"
Lapping to ą 0.01mm "L"
(for example ST-127-1.0-3.0"PE")

Module Characteristics and Value Descriptions:
I_max is the maximum (optimal) input current in amperes
V_max is the maximum input voltage in volts when the current is optimal (I_max)
Q_max is the maximum amount of heat the module is capable of pumping. This value is achieved when there is no difference in the temperature (DT=0) on the modules two surfaces. If your application requires cooling, the heat pumping capacity will be less.

DT_max or DT_max is the maximum temperature differential between the hot and cold side of the module with no heat load (Q=0)
As the thermal mass of the object to be cooled increases the DT becomes fewer degrees until Qmax is reached and DT=0.

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